(Information sent by the signatory company)
- Revasum Inc and Asahi Diamond America, Inc join forces to revolutionize silicon carbide wafer grinding
SAN LUIS OBISPO, Calif., Jan. 16, 2024 /PRNewswire/ -- Revasum Inc, a global leader in semiconductor manufacturing equipment, and Asahi Diamond America, Inc, a renowned provider of diamond and cubic boron nitride tools, join forces are pleased to announce their strategic collaboration aimed at improving the grinding of silicon carbide (SiC) wafers.
The collaboration centers around the use of Revasum's industry-leading 7AF-HMG silicon carbide grinder, a cutting-edge solution designed specifically for the unique challenges posed by 150mm and 200mm silicon carbide wafers. This collaboration brings together Revasum's expertise in semiconductor grinding and Asahi Diamond America's cutting-edge abrasive technology, marking a significant step forward in silicon carbide wafer manufacturing.
The 7AF-HMG is distinguished by its hard material-optimized grinding motor that quickly and accurately thins and plans 150mm and 200mm silicon carbide wafers. Its advanced features and precision make it a game-changer in the industry, ensuring highly efficient and productive processing of bare substrates and device wafers at customer sites.
Scott Jewler, CEO of Revasum Inc, expressed his excitement, stating: "Our work with Asahi Diamond America is a testament to our commitment to innovation and excellence in semiconductor manufacturing. The 7AF-HMG silicon carbide grinder is "an innovative solution that addresses unique silicon carbide wafer challenges, and this cooperation will drive the industry forward by improving efficiency and performance."
Koichi "Ken" Kikuchi, CEO of Asahi Diamond America, Inc, echoed this sentiment, noting: "Asahi Diamond America is delighted to collaborate with Revasum Inc to take silicon carbide wafer grinding to new heights. Our "State-of-the-art grinding wheels combined with Revasum's advanced tooling will enable semiconductor manufacturers to achieve unprecedented precision and efficiency in silicon carbide wafer processing."
For more information, contact:
Info@revasum.com
About Revasum Inc:
Revasum Inc is a global leader in the design and manufacturing of advanced semiconductor processing equipment. Focusing on innovation and reliability, Revasum offers cutting-edge solutions for the production of silicon carbide wafers and other semiconductor materials.
About Asahi Diamond America, Inc:
Asahi Diamond America, Inc is a leading supplier of diamond and cubic boron nitride tools for a wide range of industries, including semiconductor manufacturing. With a commitment to quality and precision, Asahi Diamond America offers advanced tools that improve the efficiency and performance of semiconductor processing.
Logo - https://mma.prnewswire.com/media/2147901...
View original content: https://www.prnewswire.com/news-releases/revasum-inc-y-asahi-diamond-america-inc-revolucionan-el-rectificado-de-obleas-de-carburo-de-silicio-302035613.html
