RELEASE: Fibocom reinforces intelligence in the device with the SC208 intelligent module at MWC 2024

(Information sent by the signatory company).

RELEASE: Fibocom reinforces intelligence in the device with the SC208 intelligent module at MWC 2024

(Information sent by the signatory company)

- Fibocom reinforces on-device intelligence with the recently launched SC208 smart module based on the Snapdragon 460 mobile platform at MWC Barcelona 2024

Intelligence at the Edge moves AI computing from the cloud to edge devices, where data is generated. Allowing terminals to process and analyze data on the device, reducing the need to transmit it to the cloud and obtaining greater efficiency. Driving intelligence at the edge of smart IoT terminals, Fibocom launches a high-performance SC208 smart module with global-scale 4G cellular mobile experiences and impressive multimedia processing capabilities during MWC Barcelona 2024.

BARCELONA, Spain, March 11, 2024 /PRNewswire/ -- Fibocom (Stock Code: 300638), a leading global provider of wireless solutions for IoT (Internet of Things) and wireless communication modules, launches a smart mode module SC208 highly integrated multiplex with huge performance advances in the 4G category and a series of improvements in the multimedia experience during MWC Barcelona 2024. Powered by the Snapdragon®™ 460 mobile platform with an octa-core processor (4*A73 1.8GHz 4 *A53 1.6GHz) and with a high-performance graphics processing unit (GPU), the module is capable of multitasking in terms of 1080P video streaming, input from multiple cameras simultaneously while balancing power consumption, strengthening the adoption of smart wireless solutions in industries such as smart point of sale, industrial phones, body cameras, PoC terminals, vehicle applications, smart homes and more.

Fibocom SC208 is designed to meet the growing demand for edge intelligence for IoT smart endpoints by integrating the Snapdragon 460 mobile platform, enabling a 2x increase in overall system performance compared to previous generations. Supporting MIPI DSI at 2520x1080 and offering DDR4X in memory selection, SC208 brings multiple advances in overall performance. In hardware design, it adopts an LCC LGA form factor, allowing customers to seamlessly migrate from Fibocom's 4G smart module portfolio, which includes SS808, SQ808, SC128, SU808, SC138 and SC228. Furthermore, the 4G intelligent medium module is equipped with multi-constellation GNSS for accurate indoor and outdoor location tracking service. Furthermore, it comes pre-configured with an upgradable Android 14 operating system along with a wide range of interfaces such as MIPI/USB/UART/SPI/I2C, etc., allowing great flexibility and ease of integration to meet various demands of applications. the IoT industry.

"Qualcomm Technologies is excited to collaborate with Fibocom to help them advance intelligence capabilities at the edge of smart IoT endpoints. The launch of the SC208 module, powered by the Snapdragon 460 platform, brings impressive advancements in performance and multimedia processing capabilities to cutting edge," said ST Liew, Vice President of QUALCOMM CDMA Technologies Asia-Pacific Pte. Ltd. and President of Qualcomm Taiwan, Asia-Pacific, Australia and New Zealand region. "We are proud to support Fibocom in its mission to drive the adoption of intelligent wireless solutions across diverse industries. Together, we are enabling digital transformation with greater intelligence at the edge."

Intelligence at the edge is inevitably gaining prominence in the IoT industry, ensuring greater productivity and processing of data-intensive tasks. "The SC208 we launched today is positioned to power the core of IoT smart terminals with highly integrated wireless solutions," said Ralph Zhao, VP of MC BU at Fibocom. "We are proud of our collaboration with Qualcomm Technologies and building edge intelligence infrastructure based on the Snapdragon 460 Mobile Platform. With increased edge capacity, we are optimistic in our ability to facilitate digital transformation with more intelligence."

The SC208 will be ready for mass production in April 2024 for industrial customers worldwide. Learn more about Fibocom's smart module portfolio at the booth

Snapdragon is a trademark or registered trademark of Qualcomm Incorporated.

Snapdragon branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

About Fibocom

Fibocom is a world-leading supplier of wireless communication modules and solutions, as well as the first wireless communication module supplier listed on China A-share stock market (stock code: 300638). Fibocom offers a comprehensive solution for industry customers by integrating wireless communication modules and IoT solutions. With over two decades of commitment to M2M and IoT communication technology and extensive experience, we are able to provide reliable, convenient, secure and smart connectivity service to all industries, enriching smart living with a seamless wireless experience. Fibocom's product portfolio ranges from mobile modules (5G/4G/3G/2G/LPWA), automotive grade modules, AI modules, Android smart modules, GNSS modules and antenna service. Together, we aim to power digital transformation in industries like ACPC (Always Connected PC), Mobile Broadband, Smart Retail, C-V2X, Robotics, Smart Energy, IIoT, Smart Cities, Smart Agriculture, Smart Home, Telemedicine, etc. .

Latest news available through www.fibocom.com, follow us on LinkedIn / X / Facebook / Youtube.

Media contact: pr@fibocom.com

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